Features
- 通过 RoHS 测试的无铅锡膏系列。
- 锡粉细腻，印刷性好，钢网下不易干硬，适合长时间连续印刷。
- 可焊性优异，焊点饱满；焊后残余物极少，板面干净。
- SnAg0.3Cu0.7 型：低银配方，成本控制好，润湿与强度平衡，适合常规无铅回流。
- SnBi58 低温型：熔点低，适用于耐热性差的元件、柔性板与二次回流，可减少热损伤与板翘曲。
- 与 F118P 免清洗助焊剂、S35x 无铅焊丝可组成同一产品的无铅工艺链。
- 建议冷藏储存，使用前回温至室温并充分搅拌；开盖后连续印刷注意补加与钢网清洁。
Pairing & selection
For other grades in this category see below. For selection, samples and process data call the 24h hotline 15328226001 or send a message.
Demo rebuild; technical data subject to written quotation.
Lead-Free Solder Paste P3 Series
P3 系列 / SnAg0.3Cu0.7 / SnBi58 · 无铅锡膏 P3 系列
Fine powder, good printability, slow to dry out, excellent solderability and very little residue. SnAg0.3Cu0.7 standard and SnBi58 low-temperature grades.
Specifications
- 环保：通过 RoHS 测试
- 合金：SnAg0.3Cu0.7 / SnBi58
- 低温型：SnBi58
- 特点：细腻、抗干硬、低残留
- 工艺：钢网印刷 / 回流焊
- 储存：建议冷藏，回温后使用
Category
Paste Solder Paste
Lead-free P3 series (incl. SnBi58 low-temp) and leaded P1 series - printability and solderability together.